TeleCIS Wireless, a semiconductor company that develops chip technology for the broadband wireless industry, received $4 million in Series-B funding from ATA Ventures.
Funds will be used for expansion and business development. ATA Ventures' managing directors, Hatch Graham and Michio Fujimura will join the board. TeleCIS Wireless has also announced Tom Williams will serve as interim CEO. Prior to TeleCIS Wireless, Mr. Williams served as CEO or Bandwidth9.
TeleCIS Wireless is located in Santa Clara, California.
Lead Source: Business Wire
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